Sign-off Checks Report
----------------------

Report File    : H:\ProjPCB\ADAC\FPGA-ISRAM_BGA\FPGA (SCH - Sign-off Checks Report).txt
Report Written : Thursday, August 12, 2010
Project Path   : H:\ProjPCB\ADAC\FPGA-ISRAM_BGA\FPGA.prj
Design Path    : H:\ProjPCB\ADAC\FPGA-ISRAM_BGA\FPGA.sch
Design Title   : 
Created        : 
Last Saved     : 12.08.2010 14:17:30
Editing Time   : 34237 min
Units          : thou (precision 2)

Results
-------


No errors found

Settings
--------

Spacings

    Tracks                             No
    Pads and Vias                      No
    Shapes                             No
    Text                               No
    Board                              No
    Drills                             No
    Components                         No

Manufacturing

    Drill Breakout                     No
    Drill Backoff                      No
    Silkscreen Overlap                 No
    Wires                              No
    Component Height                   No
    Copper Text In Board               No
    Min Track Width                    No
    Neck Length                        No
    Min Annular Ring                   No
    Min Paste Size                     No
    Vias In Pads                       No
    Unplated Vias                      No
    Unplated Pads With Inner Tracks    No

Nets

    Net Completion                     No
    Dangling Tracks                    No
    Net Track Length Differences       No


End Of Report.